• DocumentCode
    2590617
  • Title

    Transverse Surface Waves in a Functionally Graded Piezoelectric Half-Space with a Hard Dielectric Layer

  • Author

    Jin, Feng ; Qian, Zheng-hua ; Kishimoto, Kikuo

  • Author_Institution
    Dept. of Mech. Sci. & Eng., Tokyo Inst. of Technol., Tokyo
  • fYear
    2008
  • fDate
    10-12 Sept. 2008
  • Firstpage
    679
  • Lastpage
    683
  • Abstract
    As to an ideally layered structure with a functionally graded piezoelectric substrate and a hard dielectric layer, the existence and propagation behavior of transverse surface waves is studied by analytical technique. The dispersion equations for the existence of the transverse surface waves with respect to phase velocity are obtained for electrically open and short circuit conditions, respectively. A detailed investigation of the effect of gradient coefficient on dispersion relation, electromechanical coupling factor is carried out. It is found by numerical examples that adjusting gradient coefficient makes the electromechanical coupling factor of the transverse surface waves achieve quite high values at some appropriate ratio values of the layer thickness to the wavelength.
  • Keywords
    dielectric thin films; dispersion relations; electromechanical effects; functionally graded materials; inhomogeneous media; piezoelectric materials; surface acoustic wave devices; SAW devices; dispersion equations; dispersion relation; electromechanical coupling factor; functionally graded piezoelectric half-space; gradient coefficient; hard dielectric layer; layered structure; phase velocity; surface acoustic wave; transverse surface waves; Acoustic waves; Coupling circuits; Dielectric substrates; Dispersion; Equations; Piezoelectric materials; Surface acoustic wave devices; Surface acoustic waves; Surface waves; Vacuum technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2008 China-Japan Joint
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-3821-1
  • Type

    conf

  • DOI
    10.1109/CJMW.2008.4772520
  • Filename
    4772520