Title : 
Transverse Surface Waves in a Functionally Graded Piezoelectric Half-Space with a Hard Dielectric Layer
         
        
            Author : 
Jin, Feng ; Qian, Zheng-hua ; Kishimoto, Kikuo
         
        
            Author_Institution : 
Dept. of Mech. Sci. & Eng., Tokyo Inst. of Technol., Tokyo
         
        
        
        
        
        
            Abstract : 
As to an ideally layered structure with a functionally graded piezoelectric substrate and a hard dielectric layer, the existence and propagation behavior of transverse surface waves is studied by analytical technique. The dispersion equations for the existence of the transverse surface waves with respect to phase velocity are obtained for electrically open and short circuit conditions, respectively. A detailed investigation of the effect of gradient coefficient on dispersion relation, electromechanical coupling factor is carried out. It is found by numerical examples that adjusting gradient coefficient makes the electromechanical coupling factor of the transverse surface waves achieve quite high values at some appropriate ratio values of the layer thickness to the wavelength.
         
        
            Keywords : 
dielectric thin films; dispersion relations; electromechanical effects; functionally graded materials; inhomogeneous media; piezoelectric materials; surface acoustic wave devices; SAW devices; dispersion equations; dispersion relation; electromechanical coupling factor; functionally graded piezoelectric half-space; gradient coefficient; hard dielectric layer; layered structure; phase velocity; surface acoustic wave; transverse surface waves; Acoustic waves; Coupling circuits; Dielectric substrates; Dispersion; Equations; Piezoelectric materials; Surface acoustic wave devices; Surface acoustic waves; Surface waves; Vacuum technology;
         
        
        
        
            Conference_Titel : 
Microwave Conference, 2008 China-Japan Joint
         
        
            Conference_Location : 
Shanghai
         
        
            Print_ISBN : 
978-1-4244-3821-1
         
        
        
            DOI : 
10.1109/CJMW.2008.4772520