FEM thermal analysis of quartz oscillator with COMSOL

Author

Carron, T. Louvet ; Leost, J.

Author_Institution

Adv. R&D Dpt, TEMEX, Pont Ste. Marie, France

fYear

2009

fDate

20-24 April 2009

Firstpage

482

Lastpage

486

Abstract

The aim of this paper is to show that commercial software is able to realize an utter thermal analysis of a quartz oscillator. SOLIDWORKS files of the mechanical assembly are simplified and exported into COMSOL. Based on the assumption that under vacuum the heat transfer process is the conduction, material properties and boundary conditions are filled in the different pop-up boxes to solve the conduction equation. This paper presents results of modelisation applied to a new design which is developed by TEMEX: a new space OCXO with low consumption and low noise oscillator has been designed with this FEM modelisation.

Keywords

assembling; crystal oscillators; electrical conductivity; finite element analysis; heat transfer; thermal analysis; COMSOL; FEM thermal analysis; SOLIDWORKS; TEMEX; boundary conditions; commercial software; conduction equation; heat transfer process; material properties; mechanical assembly; quartz oscillator; Assembly; Boundary conditions; Copper; Equations; Geometry; Heat transfer; Numerical models; Oscillators; Solid modeling; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Frequency Control Symposium, 2009 Joint with the 22nd European Frequency and Time forum. IEEE International

Conference_Location

Besancon

ISSN

1075-6787

Print_ISBN

978-1-4244-3511-1

Electronic_ISBN

1075-6787

Type

conf

DOI

10.1109/FREQ.2009.5168226

Filename

5168226