Title :
FEM thermal analysis of quartz oscillator with COMSOL
Author :
Carron, T. Louvet ; Leost, J.
Author_Institution :
Adv. R&D Dpt, TEMEX, Pont Ste. Marie, France
Abstract :
The aim of this paper is to show that commercial software is able to realize an utter thermal analysis of a quartz oscillator. SOLIDWORKS files of the mechanical assembly are simplified and exported into COMSOL. Based on the assumption that under vacuum the heat transfer process is the conduction, material properties and boundary conditions are filled in the different pop-up boxes to solve the conduction equation. This paper presents results of modelisation applied to a new design which is developed by TEMEX: a new space OCXO with low consumption and low noise oscillator has been designed with this FEM modelisation.
Keywords :
assembling; crystal oscillators; electrical conductivity; finite element analysis; heat transfer; thermal analysis; COMSOL; FEM thermal analysis; SOLIDWORKS; TEMEX; boundary conditions; commercial software; conduction equation; heat transfer process; material properties; mechanical assembly; quartz oscillator; Assembly; Boundary conditions; Copper; Equations; Geometry; Heat transfer; Numerical models; Oscillators; Solid modeling; Temperature;
Conference_Titel :
Frequency Control Symposium, 2009 Joint with the 22nd European Frequency and Time forum. IEEE International
Conference_Location :
Besancon
Print_ISBN :
978-1-4244-3511-1
Electronic_ISBN :
1075-6787
DOI :
10.1109/FREQ.2009.5168226
