Title :
The PEER program: Creating a pre-College computer and semiconductor curriculum in the rocky mountain region
Author :
McDonnell, Katherine ; Chen, Tom
Author_Institution :
Colorado State Univ., Fort Collins
Abstract :
The Partnership for Engineering Education in the Rockies (PEER) has developed an electrical and computer engineering curriculum for high school students in the Northern Colorado region. PEER brings together representatives from the semiconductor industry and educational institutions, led by Colorado State University, who are dedicated to improving and expanding the pool of local engineering candidates. The program focuses on recruiting high school students and displaced or unemployed individuals who are interested in pursuing careers in ECE or mask design. PEER offers multiple courses at a local high school during the school year and a summer camp for students to learn the fundamentals of computer and semiconductor technology. The PEER program also trains and supports high school teachers interested in the curriculum. Over the past three years, the PEER program has reached over 100 students throughout the country. The PEER program has been successful at recruiting students into the ECE and semiconductor field, and the effects of the program on the local workforce are just now starting to be felt.
Keywords :
computer science education; electronic engineering education; Colorado State University; Partnership for Engineering Education in the Rockies; educational institutions; high school students; precollege computer and semiconductor curriculum; semiconductor industry; Computer industry; Computer science education; Educational institutions; Electronics industry; Engineering education; Engineering profession; Industrial training; Peer to peer computing; Recruitment; Unemployment; High School; PEER; STEM; Semiconductors;
Conference_Titel :
Frontiers In Education Conference - Global Engineering: Knowledge Without Borders, Opportunities Without Passports, 2007. FIE '07. 37th Annual
Conference_Location :
Milwaukee, WI
Print_ISBN :
978-1-4244-1083-5
Electronic_ISBN :
0190-5848
DOI :
10.1109/FIE.2007.4417973