• DocumentCode
    259146
  • Title

    Numerical free-disposal-hull data-envelopment analysis of potential CMOS-successor technologies

  • Author

    Korb, Matthias ; Kleine, Andreas

  • Author_Institution
    Broadcom, Irvine, CA, USA
  • fYear
    2014
  • fDate
    17-20 Nov. 2014
  • Firstpage
    707
  • Lastpage
    710
  • Abstract
    Moore´s law will slow down in the next decades and potentially even stop due to unbridgeable physical challenges. In order to continue the trend of progressively increasing complex designs with ever-decreasing costs per transistor, the CMOS technology will have to be replaced by a new device technology. There are a multitude of these technologies known today. However, the identification of the most promising technologies is challenging due to two reasons. First, the successor technologies need to be assessed based on quantitative metrics (e.g., energy and speed) and qualitative metrics (e.g., reliability and CMOS compatibility). Second, most of the technologies are still in a very early stage, and only estimations on their characteristics are available. In this paper, we present a new methodology that enables a combined evaluation of qualitative and quantitative characteristics, and which can handle imprecise data in terms of uncertainty intervals. The methodology is applied to a data set taken from the International Technology Roadmap for Semiconductors.
  • Keywords
    CMOS integrated circuits; benchmark testing; data envelopment analysis; probability; International Technology Roadmap for Semiconductors; numerical free-disposal-hull data-envelopment analysis; potential CMOS-successor technologies; qualitative metrics; quantitative metrics; uncertainty intervals; Benchmark testing; CMOS integrated circuits; Measurement; Probability density function; Scalability; Transistors; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (APCCAS), 2014 IEEE Asia Pacific Conference on
  • Conference_Location
    Ishigaki
  • Type

    conf

  • DOI
    10.1109/APCCAS.2014.7032879
  • Filename
    7032879