Title :
The Chip-Scale Atomic Clock - Recent developments
Author_Institution :
Symmetricom - Technol. Realization Center, Beverly, MA, USA
Abstract :
We report on recent advances in the core performance and capabilities of the chip-scale atomic clock.
Keywords :
atomic clocks; chip scale packaging; chip-scale atomic clock; Assembly; Atomic clocks; Contracts; Electronic packaging thermal management; Energy consumption; Laboratories; Laser stability; Physics; Thermal conductivity; Timing;
Conference_Titel :
Frequency Control Symposium, 2009 Joint with the 22nd European Frequency and Time forum. IEEE International
Conference_Location :
Besancon
Print_ISBN :
978-1-4244-3511-1
Electronic_ISBN :
1075-6787
DOI :
10.1109/FREQ.2009.5168247
