Title :
Microstructural change and hardness of lead free solder alloys
Author :
Miyazawa, Yasuyuki ; Ariga, Tadashi
Author_Institution :
Dept. of Metall. Eng., Tokai Univ., Kanagawa, Japan
Abstract :
Two types of Pb free solder, Sn-Ag eutectic alloy and Sn-Zn eutectic alloy, as potential replacements for Sn-Pb eutectic solder and Sn-Pb eutectic alloy were found to age-soften during storage at room temperature (25 C, 298 K, 77 F) and high temperature (100 C, 373 K 212 F). The hardness of another type of Pb free solder, Sn-Bi eutectic alloy, did not change during storage at room and high temperature. However, the microstructure of Sn-Bi eutectic alloy coarsened unusually during storage at room and high temperature.
Keywords :
ageing; bismuth alloys; environmental factors; silver alloys; soldering; tin alloys; zinc alloys; 100 C; 212 F; 25 C; 298 K; 373 K; 77 F; Sn-Ag; Sn-Ag eutectic alloy; Sn-Bi; Sn-Zn; Sn-Zn eutectic alloy; age-softening; lead free solder alloys; microstructural change; microstructural hardness; Aging; Electron emission; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Microstructure; Optical microscopy; Solids; Temperature; Tin;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
Conference_Location :
Tokyo, Japan
Print_ISBN :
0-7695-0007-2
DOI :
10.1109/ECODIM.1999.747686
