Title :
Polyimide stress buffers in IC technology
Author :
Schuckert, Craig ; Murray, Dan ; Roberts, Carl ; Cheek, Gary ; Goida, Tom
Author_Institution :
DuPont Co., Wilmington, DE, USA
Abstract :
A photoimagable polyimide layer which has been evaluated as a stress relief buffer for use with integrated circuits (ICs) packaged in plastic is discussed. The wafer-level overcoat process is manufacturable using available spin coat and develop tracks and is compared to conventional post wirebond die overcoating. Some properties of the polyimide layer, the manufacturing process, and the results achieved on actual commercial products are reviewed
Keywords :
integrated circuit manufacture; integrated circuit technology; polymer films; IC technology; integrated circuits; manufacturing process; photoimagable polyimide layer; plastic packaged ICs; spin coat/develop process; stress relief buffer; wafer-level overcoat process; Coatings; Dielectric thin films; Manufacturing processes; Packaging; Plastics; Polyimides; Semiconductor device manufacture; Semiconductor materials; Spine; Thermal stresses;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1990. ASMC 90 Proceedings. IEEE/SEMI 1990
Conference_Location :
Danvers, MA
DOI :
10.1109/ASMC.1990.111222
