DocumentCode
2591755
Title
Scaled 2bit/cell SONOS type nonvolatile memory technology for sub-90nm embedded application using SiN sidewall trapping structure
Author
Fukuda, M. ; Nakanishi, T. ; Nara, Y.
Author_Institution
Fujitsu Labs. Ltd., Kanagawa, Japan
fYear
2003
fDate
8-10 Dec. 2003
Abstract
We demonstrate and experimentally investigate the scalability of a new 2bit/cell SONOS type nonvolatile memory cell. This memory has single layer of gate oxide and SiN sidewalls at both sides of the gate to store the charge. We have found the sidewall trapping structure is much more scalable than conventional planar SONOS structures by the precise control of alignment between the pn junction edge and the SiN sidewall. The proposed device with gate length down to 60 nm was successfully operated with the Vth window, which is the Vth difference between forward and reverse operation, of 0.6 V. Also, by employing a 2D device simulator, we found that the degradation mechanism after cycled endurance testing is the negative charge accumulation near the SiO/sub 2//Si interface on the source/drain region.
Keywords
elemental semiconductors; random-access storage; semiconductor device models; semiconductor-insulator-semiconductor devices; silicon; silicon compounds; 0.6 V; 60 nm; SONOS type nonvolatile memory cell; SiN sidewall trapping structure; SiO/sub 2/-Si-SiN; degradation mechanism; gate length; silicon-oxide-nitride-oxide-semiconductor; single layer gate oxide; source/drain region negative charge accumulation; Degradation; Electrodes; Laboratories; Medical simulation; Metalworking machines; Nonvolatile memory; SONOS devices; Scalability; Silicon compounds; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-7872-5
Type
conf
DOI
10.1109/IEDM.2003.1269426
Filename
1269426
Link To Document