DocumentCode :
2591934
Title :
In-line process monitoring using surface charge analysis
Author :
Resnick, Allan ; Kamieniecki, Emil ; Phelps, Hal ; Jackson, Daniel
Author_Institution :
SemiTest Inc., Billerica, MA, USA
fYear :
1990
fDate :
11-12 Sep 1990
Firstpage :
117
Lastpage :
120
Abstract :
The effect of pull temperature on oxide charge and interface trap density is explored using surface charge analysis (SCA). With this technique, lower pull temperatures were found to result in lower oxide charge and interface trap density levels. The impact of pull temperature on these parameters was found to exist even after a number of additional processing steps. SCA was used to evaluate the individual charge contribution of each step within a process sequence
Keywords :
electron traps; monitoring; process control; semiconductor technology; interface trap density; oxide charge; process sequence; processing steps; pull temperature; surface charge analysis; Capacitance-voltage characteristics; Charge measurement; Cleaning; Current measurement; Electric variables measurement; Monitoring; Pollution measurement; Production; Semiconductor device doping; Surface contamination;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1990. ASMC 90 Proceedings. IEEE/SEMI 1990
Conference_Location :
Danvers, MA
Type :
conf
DOI :
10.1109/ASMC.1990.111234
Filename :
111234
Link To Document :
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