• DocumentCode
    2592030
  • Title

    Assembly and interconnection of microsystems

  • Author

    Foster, C.J.

  • Author_Institution
    TWI, Cambridge, UK
  • fYear
    1997
  • fDate
    35487
  • Firstpage
    42370
  • Lastpage
    42371
  • Abstract
    The objective of this paper is to provide an overview of technologies and materials available for Microsystems Assembly and Interconnection
  • Keywords
    microassembling; assembly; interconnection; microsystem;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:19970019
  • Filename
    597319
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2592030