• DocumentCode
    2592218
  • Title

    A novel piezoelectric device with dual functions of studying biological soft tissues

  • Author

    Xie, Fei ; Jamadagni, Avin ; Hao, Zhili

  • Author_Institution
    Dept. of Mech. Eng., Old Dominion Univ., Norfolk, VA, USA
  • Volume
    4
  • fYear
    2011
  • fDate
    15-17 Oct. 2011
  • Firstpage
    2360
  • Lastpage
    2364
  • Abstract
    This paper presents a novel piezoelectric device with dual functions of studying soft biological tissues. The device consists of a central circular plate and a set of flexural beams. The flexural beams are partially covered with piezoelectric layer for integrated transduction. It can function as a force sensor for measuring the mechanical behavior of a tissue sample and a load applier for mimicking physiological loads experienced by the tissue sample in vivo, while the mechanical behavior can be visually observed under a microscope simultaneously. By combining the classic theories in solid mechanics and piezoelectricity, the performance of the piezoelectric device is analyzed. Based on the mechanical behavior obtained from traditional experimental studies on cartilage, the piezoelectric device is designed and optimized for studying cartilage at the micro/nano-scale. The fabrication process for the piezoelectric device is also discussed.
  • Keywords
    biomechanics; bone; force sensors; nanomedicine; piezoelectric devices; biological soft tissues; central circular plate; flexural beams; force sensor; in vivo study; integrated transduction; mechanical behavior; microscale cartilage; microscope; nanoscale cartilage; physiological loads; piezoelectric device; piezoelectricity; solid mechanics; Biological tissues; Fabrication; Force; Force sensors; Nanobioscience; Piezoelectric devices; Silicon; Cartilage; SOI wafer; force sensor; load applier; piezoelectric material;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Engineering and Informatics (BMEI), 2011 4th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-9351-7
  • Type

    conf

  • DOI
    10.1109/BMEI.2011.6098773
  • Filename
    6098773