DocumentCode
2592395
Title
Flip-chip solder bonding for microsystems
Author
Humpston, G.
Author_Institution
GEC-Marconi Mater. Technol. Ltd., Towcester, UK
fYear
1997
fDate
35487
Firstpage
42430
Lastpage
42432
Abstract
Flip-chip solder bonding is a well established method for performing simultaneous interconnection and mechanical mounting of microelectronic components. It has recently been enjoying a resurgence of interest for assembly of microsystems on account of a unique process attribute, namely that the components being joined are precisely and repeatably aligned in three orthogonal directions. Sub-micron accuracy is readily achieved
Keywords
flip-chip devices; assembly; flip-chip solder bonding; interconnection; mechanical mounting; microelectronic component; microsystem; precision alignment;
fLanguage
English
Publisher
iet
Conference_Titel
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19970021
Filename
597321
Link To Document