Title :
Manufacturing Low Cost Optoelectronic Components
Author_Institution :
Hewlett-Packard Co.
fDate :
July 29 1992-Aug. 12 1992
Abstract :
Summary form only given. Discusses the manufacturing of low cost optoelectronic components and technologies.
Keywords :
Circuit testing; Cost function; Integrated circuit packaging; Integrated circuit yield; Manufacturing processes; Optical fiber communication; Optoelectronic devices; Pulp manufacturing;
Conference_Titel :
Broadband Analog and Digital Optoelectronics, Optical Multiple Access Networks, Integrated Optoelectronics, Smart Pixels, LEOS 1992 Summer Topical Meeting Digest on
Conference_Location :
Santa Barbara, CA, USA
DOI :
10.1109/LEOSST.1992.697440
