DocumentCode
2593833
Title
Gain enhancement of air substrates at 5.8GHz for microstrip antenna array
Author
Ali, M.T. ; Jaafar, H. ; Subahir, S. ; Yusof, A.L.
Author_Institution
Microwave Technol. Centre (MTC), Univ. Teknol. MARA (UiTM), Shah Alam, Malaysia
fYear
2012
fDate
21-24 May 2012
Firstpage
477
Lastpage
480
Abstract
This paper concerned on enhancement of gain for microstrip patch planar array antenna. The structure in this project is 2 by 2 microstrip patch planar array antenna using air substrate with εr= 1at frequency 5.8 GHz. Frequency for 5.8GHz can be applied to unlicensed WiMAX. In this project, the simulation is performed by using the simulation software Computer Simulation Technology (CST) Microwave Studiowhich is a commercially available electromagnetic simulator based on finite difference time domain technique. The novelty of the design is the application of air to replace regular Flame Retardant 4 (FR-4) materials as the substrate.The substrate used for the design is C-foam (thickness = 3mm) which represent as air gap. Copper foil with thickness 0.12mm is used as the patch. The performance of the designed antenna was analyzed in term of bandwidth, gain, return loss, VSWR, and radiation pattern.
Keywords
WiMax; air gaps; antenna radiation patterns; finite difference time-domain analysis; flame retardants; microstrip antenna arrays; planar antenna arrays; CST microwave studiowhich; FR-4 material; VSWR; WiMax; air gap; air substrates; antenna bandwidth; antenna gain; antenna radiation pattern; antenna return loss; computer simulation technology; copper foil; electromagnetic simulator; finite difference time domain technique; flame retardant 4 material; frequency 5.8 GHz; microstrip patch planar array antenna; Antennas; Computational modeling; Connectors; Frequency measurement; Microstrip; Photonics; Substrates; Microstrip antennas; air substrate antenna; enhanced gain microstrip antenna;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
Conference_Location
Singapore
Print_ISBN
978-1-4577-1557-0
Electronic_ISBN
978-1-4577-1558-7
Type
conf
DOI
10.1109/APEMC.2012.6237872
Filename
6237872
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