DocumentCode :
2593833
Title :
Gain enhancement of air substrates at 5.8GHz for microstrip antenna array
Author :
Ali, M.T. ; Jaafar, H. ; Subahir, S. ; Yusof, A.L.
Author_Institution :
Microwave Technol. Centre (MTC), Univ. Teknol. MARA (UiTM), Shah Alam, Malaysia
fYear :
2012
fDate :
21-24 May 2012
Firstpage :
477
Lastpage :
480
Abstract :
This paper concerned on enhancement of gain for microstrip patch planar array antenna. The structure in this project is 2 by 2 microstrip patch planar array antenna using air substrate with εr= 1at frequency 5.8 GHz. Frequency for 5.8GHz can be applied to unlicensed WiMAX. In this project, the simulation is performed by using the simulation software Computer Simulation Technology (CST) Microwave Studiowhich is a commercially available electromagnetic simulator based on finite difference time domain technique. The novelty of the design is the application of air to replace regular Flame Retardant 4 (FR-4) materials as the substrate.The substrate used for the design is C-foam (thickness = 3mm) which represent as air gap. Copper foil with thickness 0.12mm is used as the patch. The performance of the designed antenna was analyzed in term of bandwidth, gain, return loss, VSWR, and radiation pattern.
Keywords :
WiMax; air gaps; antenna radiation patterns; finite difference time-domain analysis; flame retardants; microstrip antenna arrays; planar antenna arrays; CST microwave studiowhich; FR-4 material; VSWR; WiMax; air gap; air substrates; antenna bandwidth; antenna gain; antenna radiation pattern; antenna return loss; computer simulation technology; copper foil; electromagnetic simulator; finite difference time domain technique; flame retardant 4 material; frequency 5.8 GHz; microstrip patch planar array antenna; Antennas; Computational modeling; Connectors; Frequency measurement; Microstrip; Photonics; Substrates; Microstrip antennas; air substrate antenna; enhanced gain microstrip antenna;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1557-0
Electronic_ISBN :
978-1-4577-1558-7
Type :
conf
DOI :
10.1109/APEMC.2012.6237872
Filename :
6237872
Link To Document :
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