• DocumentCode
    2593833
  • Title

    Gain enhancement of air substrates at 5.8GHz for microstrip antenna array

  • Author

    Ali, M.T. ; Jaafar, H. ; Subahir, S. ; Yusof, A.L.

  • Author_Institution
    Microwave Technol. Centre (MTC), Univ. Teknol. MARA (UiTM), Shah Alam, Malaysia
  • fYear
    2012
  • fDate
    21-24 May 2012
  • Firstpage
    477
  • Lastpage
    480
  • Abstract
    This paper concerned on enhancement of gain for microstrip patch planar array antenna. The structure in this project is 2 by 2 microstrip patch planar array antenna using air substrate with εr= 1at frequency 5.8 GHz. Frequency for 5.8GHz can be applied to unlicensed WiMAX. In this project, the simulation is performed by using the simulation software Computer Simulation Technology (CST) Microwave Studiowhich is a commercially available electromagnetic simulator based on finite difference time domain technique. The novelty of the design is the application of air to replace regular Flame Retardant 4 (FR-4) materials as the substrate.The substrate used for the design is C-foam (thickness = 3mm) which represent as air gap. Copper foil with thickness 0.12mm is used as the patch. The performance of the designed antenna was analyzed in term of bandwidth, gain, return loss, VSWR, and radiation pattern.
  • Keywords
    WiMax; air gaps; antenna radiation patterns; finite difference time-domain analysis; flame retardants; microstrip antenna arrays; planar antenna arrays; CST microwave studiowhich; FR-4 material; VSWR; WiMax; air gap; air substrates; antenna bandwidth; antenna gain; antenna radiation pattern; antenna return loss; computer simulation technology; copper foil; electromagnetic simulator; finite difference time domain technique; flame retardant 4 material; frequency 5.8 GHz; microstrip patch planar array antenna; Antennas; Computational modeling; Connectors; Frequency measurement; Microstrip; Photonics; Substrates; Microstrip antennas; air substrate antenna; enhanced gain microstrip antenna;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1557-0
  • Electronic_ISBN
    978-1-4577-1558-7
  • Type

    conf

  • DOI
    10.1109/APEMC.2012.6237872
  • Filename
    6237872