Studies of TEM mode assumption on via holes in via modelings

Author

Zhang, Yao-Jiang ; Jing, Shenhui ; Fan, Jun

Author_Institution

EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA

fYear

2012

fDate

21-24 May 2012

Firstpage

605

Lastpage

608

Abstract

The assumption of transverse electromagnetic (TEM) field distribution on via holes is checked by a two-dimensional (2D) finite difference method (FDM). It is found that for a via without pad, TEM mode assumption is a quite good approximation. However, for a via with a pad, i.e. the via pad radius is different from the via barrel radius, the field distribution on the via hole begins to deviate from the TEM mode. This indicates previous analytical formula for a via with pad may need to be modified at very high frequencies due to its usage of TEM field assumption on via holes. The results obtained by 2D FDM have been verified by a three-dimensional commercial electrostatic solver.

Keywords

electromagnetic field theory; electrostatics; finite difference methods; 2D FDM; TEM field assumption; TEM mode assumption; barrel radius; holes; three-dimensional commercial electrostatic solver; transverse electromagnetic field distribution; two dimensional finite difference method; Approximation methods; Capacitance; Electromagnetics; Frequency division multiplexing; Integrated circuit modeling; Nonhomogeneous media; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on

Conference_Location

Singapore

Print_ISBN

978-1-4577-1557-0

Electronic_ISBN

978-1-4577-1558-7

Type

conf

DOI

10.1109/APEMC.2012.6237873

Filename

6237873