DocumentCode
2593956
Title
Thermal model for data centre cooling
Author
Masson, S. Le ; Nörtershäuser, D. ; Deddy, B. ; Glouannec, P.
Author_Institution
R&D, France Telecom, Lannion, France
fYear
2011
fDate
9-13 Oct. 2011
Firstpage
1
Lastpage
6
Abstract
Electrical power devoted to telecommunication industry will grow tremendously with the development of internet services [1] [2]. In a data centre, most of the energy supplied to the IT equipments is converted into heat and diffused in a closed volume. Thus, it is necessary to study solutions to reduce energy consumptions, particularly regarding air conditioning systems [3]. Air conditioning part represents from 30 to 50% of the whole energy consumption, particularly in data centres. For usual buildings, thermal energy losses through the walls are negligible, even in winter. Air conditioning system must be used to transfer heat power from the data centre to the outside. The use of free cooling can be an easy way to reduce the energy consumption. Furthermore, if the building construction is adapted (thermal inertia, thickness of the walls, flow rate...), an optimization is possible by using a night cool storage directly in the masonry. Previous studies related to small buildings have shown good results [4]. This paper describes a numerical study in order to define new conceptions of optimized telecommunication buildings. Walls are used in order to increase heat transfer and reduced cooling energy consumption.
Keywords
air conditioning; computer centres; heat transfer; telecommunication industry; air conditioning system; data centre cooling; heat power transfer; telecommunication industry; thermal energy losses; thermal model; Adaptation models; Concrete; Cooling; Heating; Internet; Solar radiation; Steel; Data centre; cooling; numerical simulations; thermal studies;
fLanguage
English
Publisher
ieee
Conference_Titel
Telecommunications Energy Conference (INTELEC), 2011 IEEE 33rd International
Conference_Location
Amsterdam
ISSN
2158-5210
Print_ISBN
978-1-4577-1249-4
Electronic_ISBN
2158-5210
Type
conf
DOI
10.1109/INTLEC.2011.6099715
Filename
6099715
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