Title :
Low deformation and stress packaging of micro-machined devices
Author :
Dickerson, Terry ; Ward, Michael
Author_Institution :
TWI, Cambridge, UK
Abstract :
This paper reports on low deformation packaging developed for Si chips with micro-machined elements. In particular it reports on modelling that gave design guidance on the placement of the devices on the die surface
Keywords :
micromachining; Si; Si chip; design; low deformation packaging; micromachined device; modelling; thermomechanical stress;
Conference_Titel :
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19970025
