DocumentCode
2594172
Title
The Electrical Behaviors of the Interface in Solid-Insulated Distribution Equipments
Author
Zhang, Chao ; Kucera, John-Paul ; Kaluzny, Richard
Author_Institution
Cooper Power Syst., Thomas A. Edison Tech. Center, Franksville, WI
fYear
2008
fDate
26-29 Oct. 2008
Firstpage
690
Lastpage
693
Abstract
Solid-insulated distribution equipment has several design advantages when considering benefits for environmental protection, maintenance-free operation, compact-design, light weight etc. In such equipment, interfaces between different solid insulating materials are generally inevitable. The interface, depending on the placement in the equipment, is not only subjected to high electric field stress perpendicular to the interface but also to electric field stress parallel to the interface. It is therefore very important to achieve an interface with robust electrical performance in both directions. In this paper, the electrical properties of the interface subjected to the parallel electric field have been investigated. Two different types of interface samples were intentionally chosen: one composed of silicone rubber and EPDM rubber - a soft-soft type interface and the other composed of silicone rubber and fiber reinforced epoxy resin - a soft-hard type interface. Samples were evaluated for leakage current and electrical breakdown behaviors. The purpose of the research is to determine if there is a significant difference in electrical performances between the two types of interface samples accordingly. The results have been discussed.
Keywords
electric breakdown; electric fields; epoxy insulation; ethylene-propylene rubber; insulating materials; insulation testing; leakage currents; power apparatus; silicone rubber; EPDM rubber interface; electric field stress; electrical breakdown; environmental protection; ethylene propylene diene monomer rubber interface; interface samples; leakage current; silicone rubber interface; solid dielectric electrical insulation power equipment; solid insulating materials; Electric breakdown; Epoxy resins; Insulation; Leakage current; Optical fiber devices; Protection; Robustness; Rubber; Solids; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
Conference_Location
Quebec, QC
Print_ISBN
978-1-4244-2548-8
Electronic_ISBN
978-1-4244-2549-5
Type
conf
DOI
10.1109/CEIDP.2008.4772778
Filename
4772778
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