• DocumentCode
    2594229
  • Title

    Partial Discharge Endurance of Epoxy / SiC Nanocomposite

  • Author

    Tanaka, Toshikatsu ; Matsuo, Yasuaki ; Uchida, Katsumi

  • Author_Institution
    Waseda Univ., Kitakyushu
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    13
  • Lastpage
    16
  • Abstract
    Partial discharge (PD) endurance of epoxy/SiC nanocomposite was investigated in comparison with that of epoxy/silica (SiO2) nanocomposite. Filler contents were 1 wt%, 2 wt%, 3 wt%, 4 wt% and 5 wt% in epoxy/silicon carbide (SiC) nanocomposite. Evaluation was made by erosion depth and eroded cross sectional area in its profile measured with the laser surface profilometory. It was confirmed that epoxy can be much improved in its PD erosion performance by adding SiC nano fillers to a similar degree as compared to SiO2 nano fillers. Additionally, close inspection of the cone-shaped erosion profile clarifies that the shape of erosion profile is broader in epoxy/SiC nanocomposite than in epoxy/SiO2 nanocomposite. This indicates that SiC fillers tend to remain less stuck on the surface after exposure to PDs than silica fillers. One of the authors has proposed that nanometric segmentation by inorganic nano-fillers is effective to increase PD resistance. It can be assured that such function is also operative in the case of SiC as nano-fillers.
  • Keywords
    nanocomposites; partial discharges; silicon compounds; SiC; SiO2; epoxy-silica nanocomposite; epoxy-silicon carbide nanocomposite; eroded cross sectional area; erosion depth; inorganic nanofillers; laser surface profilometory; partial discharge endurance; Area measurement; Dielectrics and electrical insulation; Inspection; Partial discharges; Polyethylene; Polymers; Silicon carbide; Silicon compounds; Surface emitting lasers; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
  • Conference_Location
    Quebec, QC
  • Print_ISBN
    978-1-4244-2548-8
  • Electronic_ISBN
    978-1-4244-2549-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2008.4772782
  • Filename
    4772782