DocumentCode :
2594263
Title :
Effects of Mica Nanofillers on the Complex Permittivity of Polyamide Nanocomposites
Author :
Fuse, N. ; Sato, H. ; Tanaka, T. ; Ohki, Y.
Author_Institution :
Dept. of Electr. Eng. & Biosci., Waseda Univ., Shinjuku
fYear :
2008
fDate :
26-29 Oct. 2008
Firstpage :
540
Lastpage :
543
Abstract :
Effects of nanofiller loading on the carrier transport and molecular motion in polyamide-6/mica nanocomposites were discussed by analyzing their complex permittivity spectra. As a result, the following four dielectric polarization processes were observed; space charge polarization, alpha relaxation due to dipolar orientation, and beta relaxation due to rotation of amide groups bonded with water molecules, in addition to interfacial polarization at crystalline/amorphous boundaries. The enhancement of dielectric constant and that of loss factor due to abundance of mobile charge carriers are suppressed by the nanofiller loading. These results suggest that carrier transport is suppressed by the nanofillers. Furthermore, it was found that relaxation time becomes longer by the mica nanofiller loading both for the dipolar orientation and for the rotation of amide groups. Molecular motion is considered to be restricted in nanocomposites, which indicates a strong interaction between the resin and filler.
Keywords :
dielectric polarisation; mica; nanocomposites; permittivity; alpha relaxation; beta relaxation; complex permittivity spectra; crystalline-amorphous boundaries; dielectric constant enhancement; dielectric polarization processes; dipolar orientation; interfacial polarization; mica nanofiller loading; mobile charge carriers; molecular motion; polyamide nanocomposites; space charge polarization; Amorphous materials; Bonding; Crystallization; Dielectric constant; Dielectric losses; Motion analysis; Nanocomposites; Permittivity; Polarization; Space charge;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
Conference_Location :
Quebec, QC
Print_ISBN :
978-1-4244-2548-8
Electronic_ISBN :
978-1-4244-2549-5
Type :
conf
DOI :
10.1109/CEIDP.2008.4772784
Filename :
4772784
Link To Document :
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