• DocumentCode
    2594438
  • Title

    Low-Frequency Dielectric Response of Epoxy-Based Polymer Composites

  • Author

    David, E. ; Sami, A. ; Soltani, R. ; Frechette, M.F. ; Savoie, S.

  • Author_Institution
    Ecole de Technol. Super., Montreal, QC
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    505
  • Lastpage
    508
  • Abstract
    The low-frequency dielectric response of polymeric materials, typically in the range of 10-5 to 102 Hz at room temperature, is related to various phenomena. Direct conduction, quasi DC conduction also known as low-frequency dispersion, alpha dipolar relaxation mechanisms, which are located in the low-frequency part of the spectrum for glassy polymers, are included in these phenomena and appeared generally below 1 Hz. The presence of a load, nano or micrometric in size, is known to significantly affect the low-frequency dielectric properties of the based matrix. New mechanisms related to the morphology and interfacial effects, such as the Maxwell-Wagner interfacial polarization, could then superimpose to the already existing relaxation mechanisms. In order to further investigate the low-frequency response of various reinforced epoxy-based composites, both time and frequency domain spectroscopy were conducted. Different types of epoxy microcomposites containing a high content of quartz, i.e. 60% wt. and microcomposites load with SiC particles, were prepared. Measurements were also performed on epoxy-mica composite made of paper-backed mica flakes bonded by the resin.
  • Keywords
    composite materials; dielectric properties; polymers; spectroscopy; SiC; alpha dipolar relaxation mechanisms; based matrix; direct conduction; epoxy-based composites; epoxy-based polymer composites; frequency domain spectroscopy; glass polymers; low-frequency dielectric response; quartz; quasi-DC conduction; silicon carbide particles; the Maxwell-Wagner interfacial polarization; time domain spectroscopy; Conducting materials; Dielectric materials; Frequency domain analysis; Mechanical factors; Morphology; Polarization; Polymers; Silicon carbide; Spectroscopy; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
  • Conference_Location
    Quebec, QC
  • Print_ISBN
    978-1-4244-2548-8
  • Electronic_ISBN
    978-1-4244-2549-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2008.4772796
  • Filename
    4772796