DocumentCode :
2594438
Title :
Low-Frequency Dielectric Response of Epoxy-Based Polymer Composites
Author :
David, E. ; Sami, A. ; Soltani, R. ; Frechette, M.F. ; Savoie, S.
Author_Institution :
Ecole de Technol. Super., Montreal, QC
fYear :
2008
fDate :
26-29 Oct. 2008
Firstpage :
505
Lastpage :
508
Abstract :
The low-frequency dielectric response of polymeric materials, typically in the range of 10-5 to 102 Hz at room temperature, is related to various phenomena. Direct conduction, quasi DC conduction also known as low-frequency dispersion, alpha dipolar relaxation mechanisms, which are located in the low-frequency part of the spectrum for glassy polymers, are included in these phenomena and appeared generally below 1 Hz. The presence of a load, nano or micrometric in size, is known to significantly affect the low-frequency dielectric properties of the based matrix. New mechanisms related to the morphology and interfacial effects, such as the Maxwell-Wagner interfacial polarization, could then superimpose to the already existing relaxation mechanisms. In order to further investigate the low-frequency response of various reinforced epoxy-based composites, both time and frequency domain spectroscopy were conducted. Different types of epoxy microcomposites containing a high content of quartz, i.e. 60% wt. and microcomposites load with SiC particles, were prepared. Measurements were also performed on epoxy-mica composite made of paper-backed mica flakes bonded by the resin.
Keywords :
composite materials; dielectric properties; polymers; spectroscopy; SiC; alpha dipolar relaxation mechanisms; based matrix; direct conduction; epoxy-based composites; epoxy-based polymer composites; frequency domain spectroscopy; glass polymers; low-frequency dielectric response; quartz; quasi-DC conduction; silicon carbide particles; the Maxwell-Wagner interfacial polarization; time domain spectroscopy; Conducting materials; Dielectric materials; Frequency domain analysis; Mechanical factors; Morphology; Polarization; Polymers; Silicon carbide; Spectroscopy; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
Conference_Location :
Quebec, QC
Print_ISBN :
978-1-4244-2548-8
Electronic_ISBN :
978-1-4244-2549-5
Type :
conf
DOI :
10.1109/CEIDP.2008.4772796
Filename :
4772796
Link To Document :
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