Title :
A SPICE Macromodel for the Analysis of Lossy Dispersive Coupled GaAs Interconnect Line System
Author :
Gopalan, Bhaskar
Abstract :
A SPICE macro model for the transient analysis of lossy dispersive coupled GaAs interconnect line system is considered. The model is based on finite Fourier integral transform in spatial domain and is used to the study the transient nature of the signals, signal delays, distortions and cross talk in IC interconnections in digital integrated circuits. An equivalent circuit model is derived from the resulting nonlinear differential equations and is implemented as a macro model in a general purpose circuit simulator, SPICE. The model provides an easy method of including skin effect and dispersion of the lines. This macro model is an alternative method to the multiple PI or Tee sections lumped element modeling of distributed systems. The simulation times and accuracy are well compared to the reduced order PI section lumped element models.
Keywords :
Fourier transforms; III-V semiconductors; SPICE; equivalent circuits; gallium arsenide; integrated circuit interconnections; IC interconnections; SPICE macromodel; digital integrated circuits; equivalent circuit model; finite Fourier integral transform; lossy dispersive coupled interconnect line system; transient analysis; Dispersion; Driver circuits; Gallium arsenide; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Receivers; Coupled transmission lines; Dispersion and Crosstalk; GaAs Drivers and Receivers; Propagation delay times; Skin effect;
Conference_Titel :
VLSI Design (VLSI Design), 2011 24th International Conference on
Conference_Location :
Chennai
Print_ISBN :
978-1-61284-327-8
Electronic_ISBN :
1063-9667
DOI :
10.1109/VLSID.2011.11
