Title :
Signal integrity aware TSV positioning
Author :
Ligang Hou ; Shu Bai ; Jinhui Wang ; Xiaohong Peng ; Shuqin Geng
Author_Institution :
VLSI & Syst. Lab., Beijing Univ. of Technol., Beijing, China
Abstract :
In this paper, a signal integrity aware TSV positioning method (SITP) is introduced. Grounded TSV proved to help eliminating TSV-to-TSV coupling. A trench based 3D IC placement method is developed, transforming 2D placement into 3D placement and perform signal TSV placement with flexible grounded TSV Insertion. IBM placement benchmark is used for original 2D placement. By evaluating wire-length and runtime, SITP automatically achieve high performance 3D IC placement with considerable TSV-TSV interference elimination.
Keywords :
integrated circuit interconnections; three-dimensional integrated circuits; 2D placement; 3D IC placement method; IBM placement benchmark; SITP; TSV-to-TSV coupling; flexible grounded TSV Insertion; grounded TSV; interconnect delay reduction; signal TSV placement; signal integrity aware TSV positioning; Analytical models; Capacitance; Couplings; Integrated circuit modeling; Metals; Through-silicon vias;
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1557-0
Electronic_ISBN :
978-1-4577-1558-7
DOI :
10.1109/APEMC.2012.6237990
