• DocumentCode
    2596036
  • Title

    The evaluation flow for EMC behavior of RF ICs

  • Author

    Yin-Cheng Chang ; Wang, Bing-Yi ; Hsu, Shawn S H ; Chang, Yen-Tang ; Chiu-Kuo Chen ; Ying-Zong Juang ; Hsu-Chen Cheng ; Da-Chiang Chang

  • Author_Institution
    Chip Implementation Center, Nat. Appl. Res. Labs., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    21-24 May 2012
  • Firstpage
    321
  • Lastpage
    324
  • Abstract
    The evaluation flow for estimating the EMC behavior of RF ICs is proposed. Conducting the electronic design automation (EDA) tools, the evaluation flow naturally embeds in the conventional RF IC design flow and extracts the resistor, inductor, and capacitor components of the network efficiently. The results of the evaluation flow help the IC designer to generate the integrated circuit emission model (ICEM) composed of internal activity (IA) and power distribution network (PDN). It is useful for the co-design of IC, package, and board regarding the system-level EMC behavior in the very early design phase. The measured impedance of the PDN shows that the proposed flow is able to improve the accuracy of the predicted impedance. Additionally, the measured results of a board carrying an RF IC and being compliant with IEC-61967 show the proposed evaluation flow captures the salient properties of the spectrum emitted by the RF IC.
  • Keywords
    IEC standards; electromagnetic compatibility; electronic design automation; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; radiofrequency integrated circuits; EDA tool; IC-package-board codesign; ICEM; IEC-61967; PDN; RF IC design flow; capacitor component; design phase; electronic design automation tool; evaluation flow; inductor component; integrated circuit emission model; internal activity; power distribution network; resistor component; spectrum salient properties; system-level EMC behavior; Integrated circuit modeling; Noise; Noise measurement; Radio frequency; Resistors; Semiconductor device measurement; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1557-0
  • Electronic_ISBN
    978-1-4577-1558-7
  • Type

    conf

  • DOI
    10.1109/APEMC.2012.6237997
  • Filename
    6237997