• DocumentCode
    2596100
  • Title

    Space Charge Formation in Epoxy Resin Including Various Nanofillers

  • Author

    Hajiyiannis, Alexis ; Chen, George ; Zhang, Chao ; Stevens, Gary

  • Author_Institution
    Sch. of Electron. & Comput. Sci., Univ. of Southampton, Southampton
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    714
  • Lastpage
    717
  • Abstract
    It has been widely anticipated that the combination of recent advances in nanocomposites technology with traditional and novel resin systems may create materials with enhanced electrical, thermal and mechanical properties. It has been recognised that charge dynamics under an electric field play an important role in determining the electrical performance of a material. In this research, the pulsed electroacoustic (PEA) technique has been used to measure space charge in epoxy anhydrite samples loaded with various nano-fillers. Space charge characteristics in both dried and wet samples have been measured at ~27 kV/mm. In addition to different charge dynamics, it has also been noticed that the electrical performance of nanocomposites has been affected in the presence of moisture. Further tests have been carried out at a lower field to reveal if different mechanisms take place.
  • Keywords
    nanocomposites; polymers; space charge; electric field; electrical properties; epoxy resin; mechanical properties; nanocomposites technology; nanofillers; pulsed electroacoustic technique; space charge formation; thermal properties; Charge carrier processes; Charge measurement; Current measurement; Epoxy resins; Mechanical factors; Nanocomposites; Pulse measurements; Pulsed electroacoustic methods; Space charge; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. Annual Report Conference on
  • Conference_Location
    Quebec, QC
  • Print_ISBN
    978-1-4244-2548-8
  • Electronic_ISBN
    978-1-4244-2549-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2008.4772898
  • Filename
    4772898