DocumentCode :
2596487
Title :
Thermal stress on silver conductive adhesive solder joints: Performance evaluation of medical ultrasound array transducer
Author :
Catelani, Marcantonio ; Scarano, Valeria L. ; Bertocci, Francesco ; Singuaroli, Roberto ; Palchetti, Paolo ; Grandoni, Andrea
Author_Institution :
Dept. of Electron. & Telecommun., Univ. of Florence, Florence, Italy
fYear :
2009
fDate :
5-7 May 2009
Firstpage :
468
Lastpage :
471
Abstract :
RoHS European Directive, recently introduced, makes a restriction of hazardous substances, e.g. Lead (Pb) and so on, traditionally used in soldering process of electric components and equipments. The paper presents preliminary results concerning new electronic Pb-free solder joints, in terms of both joint performances and electronic properties. A particular application of silver conductive adhesive solder joints between a plate of piezoelectric material and fingers, brass micro-connections between the substrate of piezoelectric material and the printed circuit, is considered. Factors that influence the soldering process like “thickness of the conductive glue” and “temperature of polymerization” are analysed by means of the Design of Experiments technique. The aim is to realise samples for the experimental tests. Measurements of electrical resistance, parameter chosen like failure pointer, and morphologic and micro-chemical analyses were carried out in order to verify the samples behaviour to the thermal stresses.
Keywords :
biomedical transducers; biomedical ultrasonics; conductive adhesives; design of experiments; electric resistance measurement; performance evaluation; silver; solders; thermal stresses; ultrasonic transducer arrays; Ag; RoHS European Directive; brass microconnection; conductive glue thickness; design-of-experiments technique; electrical resistance measurement; electronic lead-free solder joint; medical ultrasound array transducer; performance evaluation; piezoelectric material plate; polymerization temperature; silver conductive adhesive solder joint; thermal stress; Biomedical transducers; Conductive adhesives; Lead; Silver; Soldering; Thermal conductivity; Thermal stresses; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers; conductive glue; piezoelectric transducer; reliability characterization; silver conductive adhesive; solder joint; thermal tests;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2009. I2MTC '09. IEEE
Conference_Location :
Singapore
ISSN :
1091-5281
Print_ISBN :
978-1-4244-3352-0
Type :
conf
DOI :
10.1109/IMTC.2009.5168494
Filename :
5168494
Link To Document :
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