مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2596735

Title :

Preface

fYear :

2012

fDate :

22-23 May 2012

Firstpage :

Lastpage :

Abstract :

Presents the welcome message from the conference proceedings.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Conference_Location :

Tokyo

Print_ISBN :

978-1-4673-0743-7

Type :

conf

DOI :

10.1109/LTB-3D.2012.6238036

Filename :

6238036

Link To Document :