Title :
Permanent & temporary wafer bonding for 3DICs: Market & applications overview
Author :
Mounier, Eric ; Baron, Jérôme ; Pizzagalli, Amandine
Author_Institution :
Yole Dev., Villeurbanne, France
Abstract :
This paper gives an overview of the markets and applications for permanent and temporary bonding technologies.
Keywords :
integrated circuit bonding; three-dimensional integrated circuits; 3DIC; permanent wafer bonding; temporary wafer bonding; Bonding; Chemistry; Degradation; Metals; Stress; Temperature sensors; Wafer bonding;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238041
