Title :
Fully cure-dependent polymer modeling and application to QFN-packages warpage
Author :
Yang, D.G. ; Ernst, L.J. ; Jansen, K.M.B. ; van´t Hof, C. ; Zhang, G.Q. ; van Driel, W. ; Bressers, H.J.L.
Author_Institution :
Delft Univ. of Technol., Netherlands
Abstract :
Process-induced warpage is an important issue for package reliability. In order to model the warpage generated during the molding process of QFN packages, a full experimental material characterization of model molding compounds is discussed in This work. Through a method of intermittent cure experiment, the master curve and both a "temperature shift factor" and a "conversion shift factor" are obtained. A series of molding experiments for QFN matrix strips with the model-molding compounds were performed. In the molding process, different combinations of molding temperature/time and post-cure/time were used. The warpage after molding and after post-cure was measured, respectively. The results show that both the filler percentage and the die thickness have significant effects on the warpage level.
Keywords :
curing; electronics packaging; mechanical variables measurement; moulding; polymers; QFN matrix strips; QFN-packages warpage; conversion shift factor; die thickness; filler percentage; fully cure-dependent polymer modeling; intermittent cure experiment; material characterization; model molding compounds; molding process; molding temperature; molding time; process-induced warpage; temperature shift factor; warpage modeling; Assembly; Curing; Elasticity; Electronic packaging thermal management; Plastic integrated circuit packaging; Polymers; Residual stresses; Semiconductor device packaging; Temperature; Viscosity;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396582
