Title :
Overview of wafer direct bonding technology: From substrate engineering to heterogeneous integration enabled by 3D wafer stacking
Author_Institution :
Parc Technol. des Fontaines, SOITEC, Bernin, France
Abstract :
The recent advances of the wafer direct bonding technology will be presented in this talk. The overview covers the technology perspective with respect to the fabrication of engineered substrates as well as 3D wafer stacking in light of the different applications for semiconductor industry.
Keywords :
three-dimensional integrated circuits; wafer bonding; 3D wafer stacking; engineered substrate; heterogeneous integration; semiconductor industry; substrate engineering; wafer direct bonding technology; Bonding; Micromechanical devices; Silicon; Silicon on insulator technology; Stacking; Substrates; Wafer bonding;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238043
