Title :
Towards heterogeneous optoelectronics integration by low temperature 3D wafer bonding
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California, Davis, CA, USA
Abstract :
Silicon CMOS and optoelectronics can greatly benefit from heterogeneous integration of compound semiconductors and dielectric waveguides by low temperature 3D wafer bonding. This paper will review progress of optoelectronics realized by low temperature 3D wafer bonding and discuss prospects of future computing and telecommunication systems-on-chip.
Keywords :
integrated optoelectronics; system-on-chip; telecommunication; wafer bonding; heterogeneous optoelectronics integration; low temperature 3D wafer bonding; telecommunication systems-on-chip; CMOS integrated circuits; Indium phosphide; Semiconductor optical amplifiers; Silicon; Vertical cavity surface emitting lasers; Wafer bonding;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238045
