Title :
Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI
Author :
Nimura, Masatsugu ; Sakuma, Katsuyuki ; Ogino, Hiroshi ; Enomoto, Tomoyuki ; Shigetou, Akitsu ; Shoji, Shuichi ; Mizuno, Jun
Author_Institution :
Waseda Univ., Tokyo, Japan
Abstract :
This paper describes hybrid solder-adhesive bonding using simple resin planarization technique for three dimensional (3D) large scale integrated circuit (LSI). The resin planarization technique is effective to remove resin on the bump surface. The results of hybrid bonding show that chip bonding and underfilling of narrow gap was achieved at same time.
Keywords :
adhesive bonding; integrated circuit bonding; large scale integration; three-dimensional integrated circuits; 3D LSI; bump surface; chip bonding; hybrid solder-adhesive bonding; narrow gap; resin planarization technique; three dimensional large scale integrated circuit; Bonding; Large scale integration; Planarization; Resins; Silicon; Substrates;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238052
