DocumentCode
2597070
Title
Adhesive bonding for integrating laser diode and optical isolator
Author
Yokoi, Hideki ; Myouenzono, Isamu ; Ichishima, Norihiko
Author_Institution
Dept. of Electron. Eng., Shibaura Inst. of Technol., Tokyo, Japan
fYear
2012
fDate
22-23 May 2012
Firstpage
91
Lastpage
91
Abstract
Integrating a laser diode and an optical isolator with a Si guiding layer was investigated by means of adhesive bonding.
Keywords
elemental semiconductors; optical isolators; semiconductor lasers; silicon; Si; adhesive bonding; laser diode; optical isolator; Diode lasers; Integrated optics; Isolators; Optical coupling; Optical films; Optical imaging; Optical interferometry;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238057
Filename
6238057
Link To Document