Title :
Atomic diffusion bonding of wafers in air with thin Au films and its application to optical devices fabrication
Author :
Shimatsu, T. ; Uomoto, M. ; Oba, K. ; Furukata, Y.
Author_Institution :
RIEC, Tohoku Univ., Sendai, Japan
Abstract :
Atomic diffusion bonding (ADB) of two flat wafers in air with Au films was studied. Experimental results indicate that wafers can be bonded in air with bonding strength of greater than 25 MPa using only 1 nm total thickness of Au and Cr underlayer on each side.
Keywords :
integrated optics; wafer bonding; atomic diffusion bonding; optical devices fabrication; wafers; Bonding; Diffusion bonding; Films; Gold; Silicon; Substrates;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238063
