DocumentCode :
2597207
Title :
Hybrid integration of LiNbO3 thin films on micromachined Si substrates using room-temperature transfer bonding
Author :
Takigawa, R. ; Higurashi, E. ; Suga, T. ; Kawanishi, T.
Author_Institution :
Sch. of Eng., Univ. of Tokyo, Tokyo, Japan
fYear :
2012
fDate :
22-23 May 2012
Firstpage :
105
Lastpage :
105
Abstract :
Summary form only given. Hybrid integration of high-quality lithium niobate (LiNbO3) single-crystal thin films (<; 5 μm) on micromachined Si substrates has been demonstrated using room-temperature flip-chip transfer bonding based on surface-activated bonding with Au microbumps.
Keywords :
bonding processes; flip-chip devices; integration; lithium compounds; micromachining; thin films; LiNbO3; Si; flip-chip transfer bonding; high-quality single-crystal thin film integration; microbump; micromachining; surface-activated bonding; Bonding; Flip chip; Gold; Lithium niobate; Optical films; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
Type :
conf
DOI :
10.1109/LTB-3D.2012.6238064
Filename :
6238064
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2597207
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