• DocumentCode
    2597293
  • Title

    Heterogeneous 3D stacking technologies after memory cubes

  • Author

    Ikeda, Hiroaki

  • Author_Institution
    Assoc. of Super-Adv. Electron. Technol. (ASET), Tokyo, Japan
  • fYear
    2012
  • fDate
    22-23 May 2012
  • Firstpage
    115
  • Lastpage
    115
  • Abstract
    ASET is developing 3D Stacking Technologies for future requirements when Memory Cubes´ (MCs) production will be ready. Key motivation beyond MCs must be heterogeneous 3D/TSV stacking systems mainly for Sensor Network Terminals. This is an introduction of ASET´s activities for the requirements.
  • Keywords
    random-access storage; stacking; three-dimensional integrated circuits; 3D-TSV stacking systems; ASET; MC production; heterogeneous 3D stacking technologies; memory cube production; sensor network terminals; Abstracts; Buildings; Failure analysis; Memory management; Production; Redundancy; Stacking;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4673-0743-7
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2012.6238067
  • Filename
    6238067
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2597293