Title :
Heterogeneous 3D stacking technologies after memory cubes
Author_Institution :
Assoc. of Super-Adv. Electron. Technol. (ASET), Tokyo, Japan
Abstract :
ASET is developing 3D Stacking Technologies for future requirements when Memory Cubes´ (MCs) production will be ready. Key motivation beyond MCs must be heterogeneous 3D/TSV stacking systems mainly for Sensor Network Terminals. This is an introduction of ASET´s activities for the requirements.
Keywords :
random-access storage; stacking; three-dimensional integrated circuits; 3D-TSV stacking systems; ASET; MC production; heterogeneous 3D stacking technologies; memory cube production; sensor network terminals; Abstracts; Buildings; Failure analysis; Memory management; Production; Redundancy; Stacking;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238067
