Title :
3D integration applications for low temperature direct bond technology
Author_Institution :
Ziptronix, Inc., Morrisville, NC, USA
Abstract :
The attributes of low temperature direct bond technology that have and continue to drive its adoption as an industry standard solution for 3D manufacturing are reviewed. These applications include backside illuminated (BSI) image sensors, 3D BSI, 3D memory, RF front ends, and pico-projectors.
Keywords :
cryogenic electronics; image sensors; integrated circuit bonding; integrated circuit manufacture; three-dimensional integrated circuits; 3D BSI; 3D integration applications; 3D manufacturing; 3D memory; RF front ends; backside illuminated image sensors; industry standard solution; low temperature direct bond technology; pico-projectors; Bonding; CMOS integrated circuits; Image sensors; Integrated circuit interconnections; Radio frequency; Temperature sensors;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238069
