DocumentCode
2597351
Title
In-situ observation of formation of eutectic structure between Au and Si
Author
Ishida, Tadashi ; Jalabert, Laurent ; Fujita, Hiroyuki
Author_Institution
Center for Int. Res. on Micronano Mechatron., Univ. of Tokyo, Tokyo, Japan
fYear
2012
fDate
22-23 May 2012
Firstpage
137
Lastpage
137
Abstract
We in-situ observed the formation reaction between Au and Si at the nanoscale. The Au nanocluster was deposited on a Si structure by electrical discharge using MEMS device inside a transmission electron microscope. The reaction at the interface did not smoothly proceed but spread in step-by-step manner.
Keywords
bonding processes; discharges (electric); elemental semiconductors; gold; micromechanical devices; silicon; transmission electron microscopes; Au; MEMS device; Si; electrical discharge; eutectic structure formation; formation reaction; in-situ observation; nanocluster; transmission electron microscope; Discharges (electric); Electrodes; Gold; Micromechanical devices; Nanoscale devices; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238070
Filename
6238070
Link To Document