Title :
Clad material by SAB method and its application in volume productions
Author :
Okayama, Hironao ; Nanbu, Kouji ; Kurokawa, Teppei ; Koshiro, Takashi
Author_Institution :
R&D Center, Toyo Kohan Co. Ltd., Kudamatsu, Japan
Abstract :
More than ten years have passed since we started operating clad-material production line by the surface activated bonding (SAB) method. For these years, we have tried to laminate a lot of combinations of different metals and released new products, which are " FINECLAD" named by Toyo Kohan Co., Ltd. In this report, we would like to show some merits for the products and introduce some present applications of these materials. For example, this clad material has been applying to substrates for an YBCO superconductive wire except for PCBs(Printed Circuit Boards) and IC packages.
Keywords :
bonding processes; cladding techniques; FINECLAD; IC packages; PCB packages; PCBs(Printed; SAB method; clad-material production line; printed circuit board packages; superconductive wire; surface activated bonding method; volume productions; Bonding; Integrated circuits; Lead; Nickel; Substrates;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238071
