DocumentCode
2597362
Title
Clad material by SAB method and its application in volume productions
Author
Okayama, Hironao ; Nanbu, Kouji ; Kurokawa, Teppei ; Koshiro, Takashi
Author_Institution
R&D Center, Toyo Kohan Co. Ltd., Kudamatsu, Japan
fYear
2012
fDate
22-23 May 2012
Firstpage
141
Lastpage
141
Abstract
More than ten years have passed since we started operating clad-material production line by the surface activated bonding (SAB) method. For these years, we have tried to laminate a lot of combinations of different metals and released new products, which are " FINECLAD" named by Toyo Kohan Co., Ltd. In this report, we would like to show some merits for the products and introduce some present applications of these materials. For example, this clad material has been applying to substrates for an YBCO superconductive wire except for PCBs(Printed Circuit Boards) and IC packages.
Keywords
bonding processes; cladding techniques; FINECLAD; IC packages; PCB packages; PCBs(Printed; SAB method; clad-material production line; printed circuit board packages; superconductive wire; surface activated bonding method; volume productions; Bonding; Integrated circuits; Lead; Nickel; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4673-0743-7
Type
conf
DOI
10.1109/LTB-3D.2012.6238071
Filename
6238071
Link To Document