A versatile optical system for metrology and defects inspection of 3D integration processes

Author

Perrot, S. ; Randle, Y. ; Fresquet, G. ; Le Bellego, D. ; Petitgrand, S. ; Coste, P. ; Bosseboeuf, A.

Author_Institution

Inst. d´´Electron. Fondamentale, Univ. Paris Sud, Orsay, France

fYear

2012

fDate

22-23 May 2012

Firstpage

191

Lastpage

191

Abstract

3D Integration of miniaturized systems at wafer level generates new needs of metrology and defects inspection for the control of temporary or permanent wafer bonding, of wafer thinning, of via interconnects technology and of wafer/die stacks. In this paper we demonstrate the capabilities of a versatile optical measurement system combining several microscopy and interferometry techniques in the visible and near infrared wavelength range.

Keywords

inspection; integrated circuit interconnections; integrated circuit measurement; interferometry; optical microscopes; wafer bonding; wafer-scale integration; 3D integration process; defect inspection; interconnects technology; interferometry technique; metrology; microscopy technique; miniaturized system; near infrared wavelength range; versatile optical measurement system; visible wavelength range; wafer bonding; wafer level; wafer thinning; wafer/die stacks; Inspection; Microscopy; Optical device fabrication; Optical imaging; Optical interferometry; Optical microscopy; Optical reflection;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on

Conference_Location

Tokyo

Print_ISBN

978-1-4673-0743-7

Type

conf

DOI

10.1109/LTB-3D.2012.6238088

Filename

6238088