Title :
Wafer-level heterogeneous 3D integration for MEMS and NEMS
Author :
Niklaus, Frank ; Lapisa, Martin ; Bleiker, Simon J. ; Dubois, Valentin ; Roxhed, Niclas ; Fischer, Andreas C. ; Forsberg, Fredrik ; Stemme, Göran ; Grogg, Daniel ; Despont, Michel
Author_Institution :
Microsyst. Technol. Lab. (MST), KTH R. Inst. of Technol., Stockholm, Sweden
Abstract :
In this paper the state-of-the-art in wafer-level heterogeneous 3D integration technologies for micro-electromechanical systems (MEMS) and nano-electromechanical systems (NEMS) is reviewed. Various examples of commercial and experimental heterogeneous 3D integration processes for MEMS and NEMS devices are presented and discussed.
Keywords :
micromechanical devices; nanoelectromechanical devices; wafer-scale integration; MEMS device; NEMS device; microelectromechanical system; nanoelectromechanical system; wafer-level heterogeneous 3D integration technology; Arrays; CMOS integrated circuits; Micromechanical devices; Mirrors; Nanoelectromechanical systems; Silicon; Substrates; MEMS; More-than-Moore; NEMS; microelectromechanical system; nano-electromechanical system; self-assembly; transfer printing; wafer-level heterogeneous integration;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4673-0743-7
DOI :
10.1109/LTB-3D.2012.6238096
