Comprehensive Failure Mechanism Theory-Metal Film Resistor Behavior

The activities described here represent the initial results of a long range program. These studies are concerned with applying the knowledge gained by failure physics investigations, to the problem of predicting electronic part behavior. The approach is to construct a computerized mathematical model from physical knowledge of part materials and their interactions. These activities are concerned with applying known relationships into a cohesive theory broadly applicable to a wide range of electronic parts, and covering a broad spectrum of stress types and stress levels. Our initial study vehicle has been a metal film resistor, formed by vapor deposition of Evanohm. That it has been necessary for us to conduct substantial experimental investigations for this single device is perhaps indicative of the fact that, to a large degree, part manufacturers have not felt the need to conduct such investigations with respect to their own product. Only to the extent that the over-all Physics of Failure program can motivate the entire community of parts manufacturers to conduct such fundamental investigations can activities toward a comprehensive failure theory completely fulfill the goal that has been set. It is impossible for all such fundamental work to be carried out specifically as the need arises by any one organization or group of organizations. Rather, it is necessary that efforts in developing a comprehensive failure theory place emphasis upon applying the knowledge gained by others.