Title :
Flip-chip, Self-aligned, Optoelectronic Transceiver Module
Author :
Jackson, K.P. ; Flint, E.B. ; Cina, M.F. ; Lacey, D. ; Trewhella, J.M. ; Buchmann, P. ; Harder, C. ; Vettiger, P.
Author_Institution :
IBM Research Division
fDate :
July 29 1992-Aug. 12 1992
Keywords :
Electronics packaging; Etching; High speed optical techniques; Optical arrays; Optical receivers; Optical transmitters; Optical waveguides; Robotic assembly; Transceivers; Waveguide lasers;
Conference_Titel :
Broadband Analog and Digital Optoelectronics, Optical Multiple Access Networks, Integrated Optoelectronics, Smart Pixels, LEOS 1992 Summer Topical Meeting Digest on
Conference_Location :
Santa Barbara, CA, USA
DOI :
10.1109/LEOSST.1992.697470
