DocumentCode
2598135
Title
An overlay vernier and process bias monitor measured by voltage contrast SEM
Author
Sprogis, Edmund J.
Author_Institution
IBM, Essex Junction, VT, USA
fYear
1989
fDate
13-14 March 1989
Firstpage
129
Lastpage
131
Abstract
A new type of vernier design which is digital in nature yet extremely dense is described. It does not require any functional circuitry to operate. Measurements can be made rapidly by simple inspection of the structure with scanning electron microscopy (SEM) operating in voltage contrast (VC) mode. This is achieved by designing a vernier where patterns either short or do not short to the wafer substrate, resulting in bright or dark regions (e.g. nonfloating or floating conductor regions) when viewed with a VC/SEM. Measurements of the location of the bright/dark interface region relate to the overlay and process bias of the monitor design levels on the wafer.<>
Keywords
VLSI; inspection; integrated circuit testing; process control; scanning electron microscopy; spatial variables measurement; VLSI process technology control; bright/dark interface region; floating conductor regions; inspection; nonfloating conductor region; overlay; process bias monitor; scanning electron microscopy; vernier design; voltage contrast SEM; wafer substrate; Circuits; Conductors; Graphics; Inspection; Monitoring; Semiconductor device measurement; Shape measurement; Testing; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 1989. ICMTS 1989. Proceedings of the 1989 International Conference on
Conference_Location
Edinburgh, UK
Print_ISBN
0-87942-714-0
Type
conf
DOI
10.1109/ICMTS.1989.39296
Filename
39296
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