• DocumentCode
    2598135
  • Title

    An overlay vernier and process bias monitor measured by voltage contrast SEM

  • Author

    Sprogis, Edmund J.

  • Author_Institution
    IBM, Essex Junction, VT, USA
  • fYear
    1989
  • fDate
    13-14 March 1989
  • Firstpage
    129
  • Lastpage
    131
  • Abstract
    A new type of vernier design which is digital in nature yet extremely dense is described. It does not require any functional circuitry to operate. Measurements can be made rapidly by simple inspection of the structure with scanning electron microscopy (SEM) operating in voltage contrast (VC) mode. This is achieved by designing a vernier where patterns either short or do not short to the wafer substrate, resulting in bright or dark regions (e.g. nonfloating or floating conductor regions) when viewed with a VC/SEM. Measurements of the location of the bright/dark interface region relate to the overlay and process bias of the monitor design levels on the wafer.<>
  • Keywords
    VLSI; inspection; integrated circuit testing; process control; scanning electron microscopy; spatial variables measurement; VLSI process technology control; bright/dark interface region; floating conductor regions; inspection; nonfloating conductor region; overlay; process bias monitor; scanning electron microscopy; vernier design; voltage contrast SEM; wafer substrate; Circuits; Conductors; Graphics; Inspection; Monitoring; Semiconductor device measurement; Shape measurement; Testing; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 1989. ICMTS 1989. Proceedings of the 1989 International Conference on
  • Conference_Location
    Edinburgh, UK
  • Print_ISBN
    0-87942-714-0
  • Type

    conf

  • DOI
    10.1109/ICMTS.1989.39296
  • Filename
    39296