DocumentCode
2598257
Title
A simple test structure for measuring substrate resistivity
Author
Orchard-Webb, J.H. ; Cloutier, Reynald
Author_Institution
Mitel Semicond., Bromont, Que., Canada
fYear
1989
fDate
13-14 March 1989
Firstpage
169
Lastpage
173
Abstract
A simple test structure for measuring the substrate resistivity of silicon integrated-circuit wafers is described. The primary application is for process validation modules, but, as the structure is very small and needs only one pad, it can also be placed on circuit chips or in the scribe lanes. The performance of the structure is evaluated for a production environment, and some applications for solving production and development problems are described.
Keywords
electrical conductivity measurement; integrated circuit testing; process control; production testing; substrates; Si; circuit chips; development problems; integrated-circuit wafers; process validation modules; production environment; resistivity measurement; scribe lanes; substrate resistivity; test structure; Circuit testing; Conductivity; Contact resistance; Electric resistance; Electrical resistance measurement; Integrated circuit measurements; Integrated circuit testing; Production; Semiconductor device measurement; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 1989. ICMTS 1989. Proceedings of the 1989 International Conference on
Print_ISBN
0-87942-714-0
Type
conf
DOI
10.1109/ICMTS.1989.39304
Filename
39304
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