DocumentCode
2598273
Title
A new test structure for in-depth lifetime profiling of thin Si epitaxial layers
Author
Spirito, P. ; Bellone, S. ; Ransom, C.M. ; Busatto, G. ; Cocorullo, G.
Author_Institution
Electron. Dept., Naples Univ., Italy
fYear
1989
fDate
13-14 March 1989
Firstpage
175
Lastpage
179
Abstract
A test structure is used to measure the recombination lifetime along very thin Si epitaxial layers used for bipolar technology. The measurement technique makes use of AC signals induced in the p/n diode by means of a bias modulation through a third (control) terminal. The experimental results show the ability of the technique to give detailed information on the quality of epi layers. Results show that the lifetime profile is not strictly correlated with the doping profile, and it can be largely altered by processes that do not change the doping profile significantly. The lifetime values detected in these layers are lower than the values reported on thicker epi layers of the same doping range, suggesting that degradation due to the proximity of the lower interface may take place in very thin layers.
Keywords
bipolar integrated circuits; carrier lifetime; doping profiles; electron-hole recombination; elemental semiconductors; semiconductor epitaxial layers; silicon; AC signals; Si epitaxial layers; bias modulation; bipolar technology; degradation; doping profile; epilayer quality; in-depth lifetime profiling; interface proximity; p/n diode; recombination lifetime; test structure; Conductivity; Diodes; Doping profiles; Electrodes; Epitaxial layers; Life testing; Measurement techniques; Spontaneous emission; Substrates; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 1989. ICMTS 1989. Proceedings of the 1989 International Conference on
Print_ISBN
0-87942-714-0
Type
conf
DOI
10.1109/ICMTS.1989.39305
Filename
39305
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