Title :
Identification and Elimination of a Failure Mechanism in Semiconductor Devices
Author :
Longo, T.A. ; Selikson, B.
Author_Institution :
Sylvania Semiconductor Division, Woburn, Massachusetts
Keywords :
Aluminum; Bonding; Failure analysis; Gold; Lead compounds; Metallization; Semiconductor devices; Silicon; Temperature; Wire;
Conference_Titel :
Physics of Failure in Electronics, 1963. Second Annual Symposium on the
Conference_Location :
Chicago, IL, USA
DOI :
10.1109/IRPS.1963.362258
