DocumentCode :
2598429
Title :
An experimental measurement technique of interconnection RC delay for integrated circuits using the step voltage response
Author :
Dos Santos F, Sebastião G. ; Swart, Jacobus W.
Author_Institution :
Sao Paulo Univ., Brazil
fYear :
1989
fDate :
13-14 March 1989
Firstpage :
233
Lastpage :
238
Abstract :
A new measurement technique for RC delay on distributed RC interconnection lines is presented using step voltage excitation. A circuit for RC delay measurement, called CIRCDEM, is proposed. This circuit can provide the RC product measurement of interconnection lines and the RC time delay to switch a gate connected to the end of the line. The interconnection resistance and the parallel-plate capacitance were also obtained by means of measurements on a cross-bridge sheet-resistor test structure and a field MOS capacitor, respectively. The values of R and C obtained from these structures are in accordance to the RC product obtained by means of CIRCDEM when the correction of the edge effect of the interconnection capacitance is taken into account.
Keywords :
VLSI; delays; integrated circuit testing; step response; time measurement; timing circuits; CIRCDEM; VLSI edge effect correction; cross-bridge sheet-resistor test structure; distributed RC interconnection lines; field MOS capacitor; integrated circuits; interconnection RC delay; interconnection resistance; parallel-plate capacitance; step voltage excitation; step voltage response; Capacitance; Delay effects; Electrical resistance measurement; Integrated circuit interconnections; Integrated circuit measurements; Measurement techniques; Switches; Switching circuits; Time measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1989. ICMTS 1989. Proceedings of the 1989 International Conference on
Print_ISBN :
0-87942-714-0
Type :
conf
DOI :
10.1109/ICMTS.1989.39315
Filename :
39315
Link To Document :
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