Nanoindentation study of the Pb-free solders in fine pitch interconnects

Author

Mohankumar, K. ; Tay, A.A.O.

Author_Institution

Dept. of Mech. Eng., National Univ. of Singapore, Singapore

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

483

Lastpage

489

Abstract

Sn-Ag/Au/Ni-P/Cu, Sn-Ag-Cu/Au/Ni-P/Cu, Sn-Ag-Bi/Au/Ni-P/Cu diffusion couples were prepared and subjected to solid stage aging at temp 170°C for 45 days. The intermetallic compound (IMC) formed at the interface of solder/substrate were characterised using SEM and their mechanical properties were measured at different strain state by using instrumented nanoindentation technique. The hardness and Young´s modulus of different IMCs formed during reflow and aging were calculated from their load-displacement data. The deformation mechanisms operating at the small length scales of IMCs has been studied in the present work.

Keywords

Young´s modulus; bismuth alloys; copper alloys; fine-pitch technology; gold alloys; indentation; integrated circuit interconnections; mechanical testing; microhardness; nickel alloys; phosphorus alloys; reflow soldering; silver alloys; solders; strain ageing; tin alloys; 170 C; Pb-tree solders; SEM; Sn-Ag-Bi-Au-Ni-P-Cu; Sn-Ag-Cu-Au-Ni-P-Cu; Young modulus; deformation mechanism; diffusion couples; fine pitch interconnects; intermetallic compound; load-displacement data; materials preparation; mechanical properties; nanoindentation study; solder/substrate interface; solid stage aging; strain state; Aging; Environmentally friendly manufacturing techniques; Gold; Instruments; Intermetallic; Mechanical factors; Mechanical variables measurement; Microelectronics; Soldering; Strain measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396656

Filename

1396656