Title :
Physics of Failure Principles Applied to a Device Development Program
Author :
Weston, T.C. ; Tomlinson, J.L.
Author_Institution :
The Boeing Company, Aero-Space Division, Seattle, Washington
Abstract :
THIS paper describes a program to develop a high-ohms-per-square tantalum, thin film resistor. Several techniques of physics of failure were used. Among these was a random balance experiment using an accelerated life test as the measure of device reliability. A physics of failure analysis on failed items resulted in the rejection of several of the materials combinations. As a result, the expected life of the basic device was increased by a factor of over one hundred.
Keywords :
Conducting materials; Fabrication; Failure analysis; Life estimation; Life testing; Physics; Resistors; Silicon; Substrates; Temperature;
Conference_Titel :
Physics of Failure in Electronics, 1964. Third Annual Symposium on the
Conference_Location :
Chicago, IL, USA
DOI :
10.1109/IRPS.1964.362287
